Module 1 (Basics and Basic Electronics)
Basics of Mobile Communication.
Study of Digital Electronics.
Assembling and Disassembling of Various Models of Mobile Phones.
Study of Various Tools & Equipment Used in Mobile Phone Repairs.
Study of Parts Inside a Mobile Phone.
Using a Multimeter.
Use of DC Power Supply (Jhatka Machine).
Module 2 (Hardware Repair)
Introduction and Study of Printed Circuit Board(Motherboard).
Details of Various Components on the PCB.
Testing of Various Parts and Components.
Study of Different ICs (chips) Used on the Motherboard.
How to Recognize Various ICs.
Soldering & Desoldering of Components by Using a Soldering iron.
Soldering & Desoldering of Components by Using a Reworkstation.
Reheating and Mounting of Various BGA and SMD Chips.
Ultrasonic Cleaning Procedure.
Module 3 (Software Installation)
Detailed Study of Various Faults Arising Due to Corrupt Software.
Introduction of Various Flasher Boxes and Software.
Flashing of Various Brands of Handsets.
Removing Virus From Infected Phones.
Unlocking of Handsets Through Codes and/or Software.
Use of Various Secret Codes.
Module 4 (Basic and Advanced Troubleshooting)
Fault Finding, Troubleshooting and Repairing of Various Faults.
Common Repair Procedure for Hardware Related Faults.
Common Repair Procedure for Software Related Faults.
Water Damaged Repair Techniques.
Circuit Tracing, Jumper Techniques and Solutions.
Troubleshooting Through Schematic Diagrams.
Use of Internet for Troubleshooting Faults.
Advanced Troubleshooting Techniques.